Thermal binning support
summary
Proposal adds a new device tree property to encode thermal variants so one DTB covers multiple SKUs, reading a two-bit fuse (stored via NVM cells) that selects which trip temperature to use (example: 95°C vs 110°C). Implementation mirrors existing opp-supported-hw behavior: trip definitions reference a bin ID instead of duplicating whole thermal nodes. Discussion covers alternative overlay or bootloader approaches, whether temperature values or trip entries should be per-bin, and an RFC is planned.
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chapters (10)
- 0:00Problem statement
- 1:28Proposed DT property
- 3:36Discussion on NVM cells
- 8:46Trip point mapping options
- 16:44Vendor practices and RFC
- 22:33Co-processor thermal management
- 26:07Cooling device interface
- 33:39User space vs kernel control
- 40:03Thermal zone binding
- 47:42Next steps
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