Sensors aggregation
summary
Proposal builds an in‑kernel mechanism that combines multiple per‑core or per‑component sensors into a single thermal zone so one governor can use an aggregated temperature (examples: max or avg) instead of conflicting PID loops. Work leverages the existing device tree binding that described multisensor aggregation but was never implemented; options include new thermal APIs rather than heavy per‑read computation and exposing membership in debugfs. Target use: make the power allocator IPA and cooling decisions behave correctly for shared cooling devices.
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