Applying New High-Throughput Network Solutions in IEC (Integrated Edge Cloud)
summary
Describes an IEC (Ocarina Type 5) data‑fabric that combines PCIe and Ethernet using a hybrid PCIe‑Ethernet switch ASIC and software‑defined routing to link up to 32 servers. Presents a stack using DPUs, low‑power SoCs and RDMA/TCP layering to scale object storage to 7 PB with about 2.5 W per drive bay (≈15% power reduction) and an NVMe‑over‑Fabric over PCIe path targeting 220M IOPS and ~1 TB/s aggregate; the build is operational but removing TCP is required to reach peak latencies.
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chapters (10)
- 0:00High-performance IEC intro
- 1:02Edge trends and Ocarina Type 5
- 5:01Cloud-edge interconnection
- 10:01Unified interface challenges
- 13:59New tech feasibility and apps
- 17:29Ocarina Type 5 architecture
- 19:16Object storage and HPC apps
- 20:23DPU workloads and CSL Q&A
- 23:12IEC use cases
- 24:58IEC future outlook
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