Exploring chip decaping techniques for silicon die inspection and reverse engineering
summary
Compares practical decapping approaches and demonstrates a workshop where participants use hot air to expose clean silicon dies for ROM decoding and reverse engineering. Methods shown include hot air, rosin/DMSO, nitric/sulphuric acid and fiber laser. Hot air yields excellent results with inexpensive tools and no chemical hazard, acids provide aggressive removal but are dangerous, and the demos successfully crack packages and reveal usable die photos.
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